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Advanced medical electronics, autonomous vehicles, smart manufacturing – these and other technological innovations call for integrated circuits that can manage complex processes, self-monitor and adapt to rapidly changing requirements.

Researchers from the University of California, Irvine and Germany’s Technical University of Braunschweig and Technical University of Munich have launched a joint project to develop next-generation computer components to meet the new challenges of digitization. The goal is to build “information processing factory” chips that bundle numerous functions and capabilities on a single platform.

Read the full story on the UCI News website.